Ruggedized Fanless embedded system with Intel® i7-9700TE 1.8GHz, (up to 3.8GHz, 8-core, TDP 35W), 8GB DDR4 pre-installed memory, 1 x PCIe by 16 & 2 x PCIe by 4 & 1 x PCIe by 1 expansion, HDMI/DP, 9~36V DC, RoHS
Key Features:
8th/9th Gen Intel Core processor platform with Intel® Q370 chipset and DDR4 memory
Dual independent displays with high-resolution support
Rich high-speed I/O interfaces
On-board internal power connector for providing power to add-on cards
Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
●CPU: 8th Gen Intel® Core™ CPU & Intel® Core™ i7-9700TE 1.8GHz (up to 3.8GHz, 8-core, TDP 35W) Intel® Core™ i5-9500TE 2.2GHz (up to 3.6GHz, 6-core, TDP 35W) ●Chipset: Intel® Q370 ●System Memory: 2 x SO-DIMM DDR4 2666/ 2400 (8GB pre-installed) (up to 64GB) ●Power: DC Jack: 9 V~36 V DC Terminal Block: 9 V~36 V DC Consumption: 19V @ 5.4A (Intel® Core™ i7-9700TE with 8GB memory) ●Reliability: Operating Shock: Half-sine wave shock 5G, 11ms, 100 shocks per axis Operating Vibration: MIL-STD-810G 514.6C-1 (SSD) Safety/EMC: CE/FCC
I/O Interface
I/O Ports
●Display: 1 x HDMI 1.4b (up to 4096 x 2304@30Hz) 1 x DP (up to 4096 x 2304@60Hz) ●6 x USB 3.2 Gen1 ●Ethernet: 3 x RJ-45 1 x PCIe GbE by I219 controller 2 x PCIe GbE by I210 controller ●COM Port: 3 x RS-232/422/485 with AFC (DB-9 w/2.5 kV isolation protection) ● Digital I/O: 8 bit Digital I/O (4-input / 4-output) ●Audio: 1 x Mic in, 1 x Line out ●TPM: 1 x TPM 2.0 (optional)
Expansion Slots
Expansion Slots
●M.2: 1 x 2230 A key (PCIe x2/ USB2.0) 2 x 2280 M key (PCIe x2) ●PCIe Mini: 1 x Full-size (PCIe/ USB 2.0/ SATA) ●Backplane: 1 x PCIe by 16 1 x PCIe by 1 2 x PCIe by 4
System
Cooling method / System Fan
Fanless
Drive Bays
4 x 2.5” HDD/SSD SATA 6Gb/s bay (with RAID 0/1/5/10 support)
Indicator&Buttons
Buttons
1 x Power Button 1 x Reset Button 1 x AT/ATX Switch
Indicators
1 x HDD LED 1 x Power LED
Physical Characteristics
Construction
Extruded aluminum alloys
Color
Color
Black C + Silver
Dimensions
Dimensions
169 x 255.2 x 225 mm
Weight
Weight
5.4 kg/8.45 kg
Environment
Operating Temperature
-20°C ~ 60°C with air flow (SSD)
Humidity
10% ~ 95%, non-condensing
Description
8th/9th Gen Intel® Core™ processor platform with Intel® Q370 chipset and DDR4 memory
Dual independent displays with high resolution support
Rich high-speed I/O interfaces
On-board internal power connector for providing power to add-on cards
Four accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support)
